Ċipep/pakketti LED Epoxy Molding Compound (EMC) jirrappreżentaw teknoloġija avvanzata ta 'ppakkjar ta' stil SMD-li tuża reżina epossidika termosetting iffurmata direttament fuq leadframe tar-ram biex tifforma akkomodazzjoni li tirrifletti ħafna integrata. B'differenza mill-pakketti tradizzjonali tal-PPA (termoplastiku), l-EMC jipprovdi reżistenza superjuri tas-sħana, stabbiltà UV, u saħħa mekkanika, li jagħmilha ideali għal applikazzjonijiet ta' qawwa medja-sa-għola-.
The core structure includes a semiconductor LED die (typically InGaN for blue emission) bonded to a silver-plated copper substrate via die-attach adhesive for excellent thermal and electrical conductivity. Gold or alloy wire bonds connect the die to the leadframe electrodes. A phosphor layer (e.g., YAG:Ce) converts blue light to white or desired spectra. The entire assembly is encapsulated in white EMC-a blend of epoxy resin, hardeners, high-reflectivity fillers (TiO₂, SiO₂), and additives-forming a reflective cup and protective body with >Riflettività ta '90% f'440 nm.
In-natura termosetting ta 'EMC tippermetti l-iffurmar tal-MAP (pakkett ta' firxa iffurmat) għal effiċjenza għolja, nuqqas ta 'qbil CTE baxx, u issikkar tal-arja eċċellenti. Speċifikazzjonijiet komuni jinkludu daqsijiet 3030/5050/7070, klassifikazzjonijiet tal-qawwa ta' 1–3W (jew ogħla f'varjanti b'ħafna -ċippa), reżistenza termali<8°C/W, operating temperatures up to 125°C junction, CRI 80–95, and lifespans >50,000 hours. It excels in automotive, outdoor, and high-lumen lighting due to solder-heat resistance (>260 grad) u MSL baxx.
